Process Capabilities

Layer Count: Single – 42 layers
Laminate Types: FR-4 (140Tg, 170Tg, 180Tg) (all UL94V-0 rated), RF and Teflon, Arlon, Getek, Rogers, Nelco and more! Thermal materials including Laird, Arlon, Ventec, Iteq and Chin-Shi, bonded to Aluminum or Copper.
Laminate Thickness: 0.003" to 0.250"
Copper Weight: 1/2 ounce to 20 ounce, finished
Line & Space Widths: 0.003"/0.003"

In order to achieve this, it is all about control – Our quality control is made step by step, process by process, by our own people, from our first contact to point of delivery. As a customer to Master Print Elektronik you define what you need – we know how to achieve it.


First slide

Capabilities

Our capabilities always give our customers a competitive edge. By using the industry's most sophisticated and latest materials and processes, our customers' are assured the most reliable, state of the art products. These latest capabilities include:

  1. Various unique materials including, Teflon, Flex, Rigid Flex, GETEK, Thermount, Rogers and other high performance materials
  2. Via-in-pad technology which utilizes silver conductive and non-conductive fillers
  3. In-house immersion silver plating process
  4. In-house wire bondable NI/AU process
  5. Fine line capabilities including, UL qualified .003" lines and space

SpecificationsStandard TechnologyAdvanced Technology
Number of Layers 1-12 14-42
Board Material
Ventec VT-47
Isola FR408
Iteq IT-180
DuPont Kapton
Rogers - 4000 Series
Epoxy Adhesive System
DuPont FR & LF
Acrylic Adhesive System
DuPont AP
Adhesiveless System
Arlon Materials
Megtron 6
Mitsui
FR408
Getek
Nelco 4000 Series
Rogers 3000 Series
Rogers 5000 Series
Rogers 6000 Series
Hitachi Theta
Taconic TLY
Polyimide
Mitsubishi BT
Berquest
Cobratherm
Flextherm
Minimum Board Thickness
2 layer - 0.010"
4 layer - 0.020"
6 layer - 0.040"
8 layer - 0.062"
10 layer - 0.062"
12 layer - 0.062"
2 layer - 0.005"
4 layer - 0.010"
6 layer - 0.031"
8 layer - 0.040"
Maximum Board Thickness
2 layer - 0.125"
3-12 layer - 0.200"
0.250" - 0.325"
Maximum Board Size
16.5" x 22.5"
17.0" X 23.0"
Layer Count Rigid 18 Layers 36 Layers
Layer Count Flex 6 Layers 12 Layers
Layer Count Rigid Flex 10 Layers 18 Layers
Copper Thickness 0.5 oz. - 3 oz. 4 oz. - 7oz.
Hole Aspect Ratio 10 : 1 15 : 1
Minimum Hole Size 0.008" 0.005"
Mechanical Drill 0.008" 0.005"
Laser Drill 0.004" 0.003"
Minimum Trace/Space 0.004"/0.004" 0.002"/0.002"
Minimum Drill-to-Copper 0.010" 0.003"
Minimum Pitch 0.004" 0.002"
Final Finish
HASL
Lead Free HASL
ENIG
Hard Gold
Gold Fingers
Immersion Silver
OSP
ENEPIG
Wire BondableGold
Electroless Gold
Selective Gold
Immersion Tin
Solder Mask
LPI:
Green
Black
Red
Blue
Clear
LPI:
Yellow
White
Orange
Purple
Magenta
Dry Film
Coverlay
FR Coverlay
LF Coverlay
Flexible Soldermask
 
Silk Screen
White
Black
Yellow
Green
Red
Blue
PCB Fabrication
Scoring
Route
Jump Scoring
Milling
Laser Rout
Additional Features
Plated Slots
Non-plated Slots
Controlled Dielectric
Covered Vias
Counter Sinks
Counter Bores
Dual Access Flex
Book Binder Flex
Plated Edges
Plated Milling
Plated Counter Bores & Counter Sinks
Edge Castellation
Controlled Impedance
Silver Filled Vias
Non-Conductive Filled Vias
Copper Filled Vias
Plated Half Holes with clean edges
Quality IPC 6012 Class 1 & 2
IPC 6013 Class 1 & 2
IPC 6012 Class 3
IPC 6013 Class 3
ITAR
ISO 9001/2015
100% Netlist Testing
TDR Testing
X-Ray Fluorescence
Special Technology  
Blind & Buried Vias
Laser Drilled Vias
Stacked micro Vias
Copper Filled Vias
Metal Backed Boards
Rigid-Flex Boards
Flex Boards
Chip Modules
MILITARY SPECIFICATION PCB Group A & B Certification
MI-P-55110
MI-P-31032

Process Options

Solder Mask over Bare Copper (SMOBC)
Solder Mask: LPI & SR1000
Carbon Ink

Surface Finishes

Gold Tab Plating
Electroless Nickel Immersion Gold (ENIG)
Lead-free HASL
OSP
Immersion Silver or Tin

CAM Capabilities

Orbotech Genesis Software
Micro-modifications
Panel/ Array Optimization
Pre-manufacturing Design Checks
Artwork Generation from Bare Boards or Blueprints
Net List Test Fixture Generation