PCB Capability

PRODUCT PLATFORM

PCB

High-Speed Multilayer 25G Optical Module 100G Optical Module 400G Optical Module Golden Finger in the Cavity High Multilayer Blind/Buried PCB 5G Communication Motherboard High Speed Backboard High Speed Data Server Board High Multilayer Antenna Board
HDI 1 Step HDI 2 Step Stack Hole HDI 3 Step Stack Hole HDI 4 Step Stack Hole HDI High Frequency HDI Heavy Copper HDI Mini LED HDI Anylayer HDI
IC Substrate D/S SLP 4L CSP 4L BGA CSP MIS CSP 6L WB SLP 10L CSP
Rigid - Flex Normal
R-F		 Flex with Gap R-F Flex with Bondply
R-F		 Stiffener with Steel R-F Flex with Blind Hole R-F Flex on the External R-F EMI with R-F Different Thicknesses R-F HDI+R-F High speed R-F Semi-Flex
High Frequency PTFE Multi-layer PCB Hybrid with High frequency PCB High Frequency Cavity PCB Millimeter Wave PCB 5G Antenna PCB 5G Coupler IMS Multi-Layer Lamination IMS Sandwich IMS Embedded Copper - Coin Super Heavy Copper PCB
Embedded PCB Embedded Daughter PCB Embedded Magnet PCB Embedded Resistance PCB Embedded Capacitance PCB Embedded Component PCB Embedded Diode PCB Embedded Chip PCB

PCB Capability

MATERIAL
Halogen Free/Lead Free SHENGYI: S1000H, S1000-2M, S1150G, S1170G; Wazam H150, H1170; ITEQ IT158, IT180A; TU752, TU86, ISOLA
High-speed Material SHENGYI S6N, S7439; Panasonic M6; TU872-SLK, TU883, TU933+, TU943N; ITEQ IT-170GT
High-frequency Material Rogers R04000 series; Taconic TLY-5, TLX-8, TSM-DS3; Panasonic R5575; SHENGYI SG220/255/300; Wazam: F4BM; FSD220/255/300/615T/1020T
Flex Section Material Panasonic RF-775; ThinFlex W, High-speed Flex Board (LK series); Dupont AG Flex Board
Others BT Material; High Thermal Conductivity Material; Copper Base; Aluminum Base Rigid PI (VT901); Buried Capacitor Material; Buried Resistor Copper Foil, Magnetic Core Material; High Resistance Carbon ink

PCB Capability

PRODUCTION CAPABILITY
TECHNICAL PROJECT TECHNICAL CAPACITY
SAMPLE BATCH
Signal Transfer Rate Max: 112 Gbps Max: 25 Gbps
Layers FR4 68 32
Rigid-Flex Total Layer / Flex Layer: 30/22 Total Layer / Flex Layer: 20/12
High Frequency Hybrid 28 20
Pure PTFE 24 16
HDI 28L/6 step 20L/3 step Substrate-Like
Substrate-Like 6 4
Size Rigid Board Max: 550 mm X 900 mm Max: 550 mm X 620 mm
Double-Sided Flexible Max: 2000 X 200 mm Max: 1250 X 200 mm
Max Final Board Thickness 12 mm 6.5 mm
Line Width/Gap PCB Min: 2.0/2.0 mil Min: 2.5/2.5 mil
IC Substrate Min: 25/25 μm Min: 25/25 μm
Maximum Copper Thickness 18 0z 6 0z
Via Diameter Mechanical Hole Min: 0.15 mm Min: 0.15 mm
Laser Hole Min: 0.06 mm Min: 0.10 mm
Half Hole Min: 0.30 mm Min: 0.40 mm
Via to Via Clearance Same Nets Min: 0.13 mm Min: 0.2 mm
Different Nets Min: 0.20 mm Min: 0.25 mm

PCB Capability

PRODUCTION CAPABILITY
TECHNICAL PROJECT TECHNICAL CAPACITY
SAMPLE BATCH
Via to inner layer copper/track ≤10L Min: 0.125 mm Min: 0.15 mm
≤10L Min: 0.15 mm Min: 0.18 mm
Aspect Ratio 25:1 16:1
Solder Bridge Green Min: 3.0 mil Min: 4.0 mil
Other Colours Min: 4.5 mil Min: 5.0 mil
Resin Filling Via Diameter 0.08 - 0.8 mm 0.1 - 0.6 mm
Impedance Tolerance +5% +10%
Gold Thickness ENIG MAX: 5 - 8 u” MAX: 3 - 5 u”
Soft Ni/Au Plating MAX: 8 - 12 u” MAX: 1 - 3 u”
Hard Ni/Au Plating MAX: 30 u” MAX: 30 u”
Surface Finish HASL-LF; OSP; Immersion Ag; Immersion Tin; ENIG; ENEPIG; Plating Gold
Special Capabilities Thick Copper with Blind Buried Via; Metal-Core; Rigid-flex; Embedded Copper Block; Hybrid High-frequency; Gold Finger; Back Drilling; Deep Slot Milling; Hole on Pad; Half Hole Countersink Hole; Sidestep Slot Via ; Overlapping Via; Peelable Mask Laser Cutting; Resin Filling Mixed Surface Treatment; Buried Components; Buried Sub-board; Self-clinching Nut; Welding Metal Board

New Technology: HDI

ITEM STANDARD CAPABILTY ADVANCE CAPABILTY
Layer ≤18 Layer 48 Layer
Material FR4 High TG, High-Speed Material High-Frequency Material
L/S Inner H Oz: 2.0 / 2.5 mil
Inner 1 Oz: 2.5 / 3.0 mil
Outer 20 - 25 μm: 2.5 / 2.5 mil		 Inner H Oz: 2.0 / 2.0 mil
Inner 1 Oz: 2.0 / 3.0 mil
Outer 20 - 25 μm: 2.0 / 2.5 mil
Step Capability 1 - 4 Step HDI 25 Step HDI
PP Thickness 0.08 mm 0.1 - 0.2 mm
Blind and Buried Holes 0.2 mm ~ 0.4 mm 0.15 - 0.5 mm
Laser Hole Diameter 0.1 - 0.15 mm 0.075 mm

New Technology: IC Substrate

ITEM PRODUCTION CAPABILTY
Material BT Core, NBF film
Layer ≤56
PP Thickness 0.04 mm - 0.08 mm
Cooper Thickness ≤20 μm
Hole Size ≥ 0.06 mm
Width of Bonding Finger ≥35 μm
BGA Pad Size ≥4 mil
L/S 0.08 mm
Line Tolerance 0.2 mm ~ 0.4 mm
Finishing ENIG. ENEPIG
Laser Hole Diameter 0.1 - 0.15 mm

New Technology: Rigid + Flex

ITEM STANDARD NON-STANDARD
Total Layer ≤18 32
Layer of Flex ≤8 <30
Copper of Flex ≤10z ≤2oz
PI Thickness 25 / 50um 75 - 150um
Hole of Flex Area Outline without PTH with PTH
Width/Gap 4 / 4 mil 3 / 3 mil
Via to Inner Lines 10 mil 8 mil
Via to Flex Area ≥4 mil 20.8 mm
Component Holes to Flex Area Outline ≥1.2 mm ≥1.0 mm
Max Panel Size 220 mm X 600 mm 450 mm x 1050 mm
Finished Thickness 0.8 - 6.0 mm 0.4 - 6.0 mm
Finishing ENIG, Immersion Tin/Silver, Flash Gold, OSP, HAL and LF HASL